Dyche Electrical Engineering Ltd

                           +44 (0)7768 415311
 

   

 

 

   

2D X-ray Inspection Service

X-Ray inspection of printed circuit boards, is ideal for applications involving loss of visual and electrical access, as is often the case with Ball Grid Arrays.

100% or batch screening prior to electrical test will ensure maximum assembled board yield.

Should a BGA process run without X-ray inspection, often ignored is the plight and attendant cost of a test engineer charged with diagnosing a fault post electrical test. Time and associated costs are high when trying to prove a BGA assembly fault, as applicable tests have to be devised and implemented, in an attempt to prove suspicions and consequently justify the cost and danger of damage to other components in the rework of a BGA. An X-ray will give an immediate, cheap answer to the solder quality under the BGA, allowing the diagnostic engineer to focus accurately on any true fault. In the real world, suspected but unproven BGA solder faults are often put to one side, to be sorted at a later date ! Well it is coming up to year end, any boards put to one side and written off, could provide 100% profit - send them to us, we will check out the BGA's, provide a picture and findings report !

Free trial - First BGA free of charge

Normal Fees - Set up and first BGA £ 125 + Vat, plus £ 25 + Vat for subsequent BGA's

All pricing is plus carriage, to facilitate fast response, a courier service is available, by arrangement     

For further information Xray_inspection@Dyche.biz or call 0044 (0) 7768 415311

 

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Last modified: July 21, 2008